| 1. |
EXECUTIVE SUMMARY |
| 1.1. |
EMI shielding for semiconductor packaging: Analyst viewpoint (I) |
| 1.2. |
EMI shielding for semiconductor packaging: Analyst viewpoint (II) |
| 1.3. |
What is electromagnetic interference (EMI) shielding? |
| 1.4. |
How does EMI shielding work? |
| 1.5. |
Factors driving developments in EMI shielding |
| 1.6. |
What materials are used for EMI shielding? |
| 1.7. |
Impact of trends in integrated circuit demand on EMI shielding industry |
| 1.8. |
Impact of changes in semiconductor package design |
| 1.9. |
Key trends for EMI shielding implementation |
| 1.10. |
Package shielding involves compartmental and conformal shielding |
| 1.11. |
Conformal package-level shielding driven by demand for compactness |
| 1.12. |
Value chain for conformal package-level shielding |
| 1.13. |
Key trends for EMI shielding deposition methods |
| 1.14. |
Comparison of sputtering and spraying |
| 1.15. |
Conclusions: Sputtering for package-level EMI shielding |
| 1.16. |
Conclusions: Spraying/printing for package-level EMI shielding |
| 1.17. |
Conclusions: Other deposition methods for package-level EMI shielding |
| 1.18. |
Conclusions: Materials for board level shielding |
| 1.19. |
Conclusions: Metallic inks for EMI shielding |
| 1.20. |
Conclusions: Nanocarbon-based materials for EMI shielding |
| 1.21. |
10-year forecast: Conformal EMI shielding surface area by deposition method |
| 1.22. |
10-year forecast: Conformal EMI shielding revenue by deposition method |
| 2. |
INTRODUCTION |
| 2.1. |
Principles and motivation for EMI shielding |
| 2.1.1. |
What is electromagnetic interference (EMI) shielding? |
| 2.1.2. |
How does EMI shielding work? |
| 2.1.3. |
Classifying sources of electromagnetic interference |
| 2.1.4. |
Shielding effectiveness scale |
| 2.1.5. |
EMI shielding is frequency specific |
| 2.1.6. |
Modes of electromagnetic interference |
| 2.1.7. |
Quantifying EMI shielding: Shielding effectiveness |
| 2.1.8. |
Assessing the shielding effectiveness of multiple materials |
| 2.1.9. |
EMI shielding requirements |
| 2.1.10. |
Requirements of conductive inks for conformal and compartmental EMI shielding |
| 2.1.11. |
Nested shielding motivates precise EMI shielding deposition methods |
| 2.1.12. |
Standards for EMI shielding |
| 2.1.13. |
The challenge of magnetic shielding at low frequencies (I) |
| 2.1.14. |
The challenge of magnetic shielding at low frequencies (II) |
| 2.2. |
Board vs package level shielding |
| 2.2.1. |
Conventional shielding techniques limited to board-level protection |
| 2.2.2. |
Transition from board to package level shielding |
| 2.2.3. |
Compartmental and conformal shielding |
| 2.3. |
Trends in semiconductor packaging and effect on EMI shielding |
| 2.3.1. |
Towards advanced semiconductor packaging / heterogenous |
| 2.3.2. |
From 1D to 3D semiconductor packaging |
| 2.3.3. |
Semiconductor packaging – technology overview |
| 2.3.4. |
Metallic inks important for heterogeneous integration |
| 2.3.5. |
Early commercial example of package-level shielding |
| 2.3.6. |
Conformal package-level EMI shielding accompanied by compartmentalization |
| 2.3.7. |
What does heterogeneous integration mean for EMI shielding? |
| 2.3.8. |
Antenna-in-package (AiP): introduction |
| 2.3.9. |
Two types of AiP structures |
| 2.3.10. |
Design concept of AiP and its benefits |
| 2.3.11. |
Three ways of mmWave antenna integration |
| 3. |
MARKET FORECASTS |
| 3.1. |
Forecast methodology |
| 3.2. |
Market forecasts by surface area |
| 3.2.1. |
10-year forecast: Conformal EMI shielding surface area by deposition method |
| 3.2.2. |
Conformal EMI shielding surface area by deposition method: Proportion |
| 3.2.3. |
10-year forecast: Sputtering for conformal EMI shielding surface area |
| 3.2.4. |
10-year forecast: Spraying/printing for conformal EMI shielding surface area |
| 3.2.5. |
10-year forecast: Plating for conformal EMI shielding surface area |
| 3.2.6. |
10-year forecast: Conformal EMI surface area coated with flake-based inks |
| 3.2.7. |
10-year forecast: Conformal EMI surface area coated with nanoparticle/hybrid inks |
| 3.2.8. |
10-year forecast: Conformal EMI surface area coated with particle free inks |
| 3.3. |
Market forecasts by surface area |
| 3.3.1. |
10-year forecast: Conformal EMI shielding revenue by deposition method |
| 3.3.2. |
10-year forecast: Proportional change in conformal EMI shielding revenue by deposition method |
| 3.3.3. |
10-year forecast: Revenue for conformal EMI surface area coated via sputtering |
| 3.3.4. |
10-year forecast: Revenue for conformal EMI surface area coated via spraying/printing |
| 3.3.5. |
10-year forecast: Revenue for conformal EMI surface area coated with flake-based inks |
| 3.3.6. |
10-year forecast: Revenue for conformal EMI surface area coated with nanoparticle/hybrid inks |
| 3.3.7. |
10-year forecast: Revenue for conformal EMI surface area coated with particle free inks |
| 3.3.8. |
10-year forecast: Revenue for conformal EMI surface area coated via plating |
| 4. |
DEPOSITION METHODS FOR PACKAGE LEVEL SHIELDING |
| 4.1. |
Overview |
| 4.1.1. |
Variety of deposition methods for package-level EMI shielding materials |
| 4.1.2. |
Comparison of sputtering and spraying |
| 4.1.3. |
Uneven top/side deposition thicknesses create additional material requirements |
| 4.2. |
Sputtering for EMI shielding |
| 4.2.1. |
Introduction to sputtering |
| 4.2.2. |
Sputtering via physical vapor deposition (PVD) workflow |
| 4.2.3. |
Sputtering equipment innovation to improve package side deposition |
| 4.2.4. |
Value chain for package-level EMI shielding with sputtering |
| 4.2.5. |
Supplier details confirm that sputtering is the dominant approach |
| 4.2.6. |
Sputtering for EMI shielding: SWOT analysis |
| 4.2.7. |
Conclusions: Sputtering for package-level EMI shielding |
| 4.3. |
Spraying/printing for EMI shielding |
| 4.3.1. |
Spraying EMI shielding: A cost effective solution |
| 4.3.2. |
Value chain for package-level shielding |
| 4.3.3. |
Process flow for competing printing methods |
| 4.3.4. |
Tilted spray coating offers even coverage across top surface and sidewalls |
| 4.3.5. |
‘Nozzle-less’ ultrasonic spray system reduces potential concerns |
| 4.3.6. |
Alternative business models for spraying/printing |
| 4.3.7. |
Example spray machines used in conformal EMI shielding |
| 4.3.8. |
Heraeus inkjet printing solution enables selective deposition |
| 4.3.9. |
Key trend for EMI shielding: Compartmentalization of complex packages |
| 4.3.10. |
Challenges with spraying EMI shielding coatings |
| 4.3.11. |
Spray coated EMI Shielding: Particle size and morphology choice |
| 4.3.12. |
Compartmental shielding through trench filling |
| 4.3.13. |
Suppliers targeting ink-based conformal EMI shielding |
| 4.3.14. |
Aerosol printing will enable selective deposition with high resolution |
| 4.3.15. |
Aerosol printing mechanism |
| 4.3.16. |
Spraying/printing for EMI shielding: SWOT analysis |
| 4.3.17. |
Conclusions: Spraying/printing for package-level EMI shielding |
| 4.4. |
Other deposition methods |
| 4.4.1. |
Other deposition methods for package-level EMI shielding |
| 4.4.2. |
Laser direct structuring (electroless plating) for antennas, circuitry, and EMI shielding. |
| 4.4.3. |
Wire bonding for EMI shielding |
| 4.4.4. |
Utilizing ‘bond via array’ for EMI shielding |
| 4.4.5. |
Fully 3D printed electronics process steps |
| 4.4.6. |
3D electronics enables co-axial shielding |
| 4.4.7. |
AME antennas in packages for 5G wireless devices |
| 4.4.8. |
Alternative deposition methods for EMI shielding: SWOT analysis |
| 4.4.9. |
Conclusions: Other deposition methods for package-level EMI shielding |
| 5. |
MATERIALS FOR EMI SHIELDING |
| 5.1. |
Overview |
| 5.1.1. |
Materials for package-level EMI shielding |
| 5.1.2. |
What materials are used for EMI shielding? |
| 5.2. |
Materials for board level shielding |
| 5.2.1. |
Conventional EMI shielding materials |
| 5.2.2. |
Larger scale EMI shielding: Making thermoplastics conductive |
| 5.2.3. |
Metal cans – comparison of metal choices |
| 5.2.4. |
Coated conductive plastics – high capital investment |
| 5.2.5. |
Conductive filler – the economical approach |
| 5.2.6. |
Conductive filler: Polymer material influences shielding effectiveness |
| 5.2.7. |
Conclusions: Materials for board level shielding |
| 5.3. |
Materials for sputtering |
| 5.3.1. |
Materials for conformal sputtering |
| 5.3.2. |
Shielding effectiveness of common sputtering materials |
| 5.3.3. |
Multilayer EMI shielding stacks utilize interference to increase shielding effectiveness. |
| 5.4. |
Metallic conductive Inks |
| 5.4.1. |
Introduction: Metallic conductive inks for EMI shielding |
| 5.4.2. |
Conductive ink requirements for EMI shielding |
| 5.4.3. |
Requirements of conductive inks for conformal and compartmental EMI shielding |
| 5.4.4. |
Specifications of conductive inks marketed at EMI shielding |
| 5.4.5. |
Silver flakes dominate conductive ink market |
| 5.4.6. |
Silver price volatility could affect ink composition |
| 5.4.7. |
Thinner flakes improve shield conductivity and durability |
| 5.4.8. |
Heraeus’ inkjet printed particle-free Ag inks |
| 5.4.9. |
Nanotech Energy has stopped its production EMI shielding materials – why? |
| 5.4.10. |
SWOT analysis: Flake-based inks for EMI shielding |
| 5.4.11. |
Overview of selected flake ink manufacturers for EMI shielding |
| 5.4.12. |
Conductive nanoparticles can enable higher conductivity than flakes |
| 5.4.13. |
Price competitiveness of silver nanoparticles |
| 5.4.14. |
Using hybrid inks improves shielding performance |
| 5.4.15. |
Ink for EMI shielding supplier: Duksan |
| 5.4.16. |
Ink-based EMI shielding suppliers: Ntrium |
| 5.4.17. |
Ink-based EMI shielding suppliers: Clariant |
| 5.4.18. |
Ink-based EMI shielding suppliers: Fujikura Kasei |
| 5.4.19. |
SWOT analysis: Nanoparticle inks for EMI shielding |
| 5.4.20. |
Overview of selected nanoparticle ink manufacturers for EMI shielding |
| 5.4.21. |
EMI shielding with particle-free inks |
| 5.4.22. |
Conductivity of particle-free silver inks close to bulk metals |
| 5.4.23. |
Particle size and morphology influence EMI shielding |
| 5.4.24. |
SWOT analysis: Particle-free inks for EMI shielding |
| 5.4.25. |
Overview of particle-free ink manufacturers for EMI shielding |
| 5.4.26. |
Particle-free / molecular inks adopted for EMI shielding |
| 5.4.27. |
Comparing metallic inks for EMI shielding |
| 5.4.28. |
Metallic inks: SWOT analysis |
| 5.4.29. |
Conclusions: Metallic inks for EMI shielding |
| 5.5. |
Nanocarbon-based materials |
| 5.5.1. |
CNTs for EMI shielding |
| 5.5.2. |
Silicone with CNT additives as a shielding material |
| 5.5.3. |
High frequency EMI shielding with CNTs |
| 5.5.4. |
Early CNT yarn applications |
| 5.5.5. |
Shielding effectiveness of nanocarbon composites |
| 5.5.6. |
Loading density and percolation thresholds for graphene composites for EMI |
| 5.5.7. |
Technology adoption for electrostatic discharge of composites |
| 5.5.8. |
Conclusions: Nanocarbon-based materials for EMI shielding |
| 5.6. |
Metamaterials |
| 5.6.1. |
Introduction: Metamaterials for EMI shielding |
| 5.6.2. |
Value proposition of metamaterials for EMI shielding |
| 5.6.3. |
Metamaterials – how do they work? |
| 5.6.4. |
Commercial opportunities against value proposition of metamaterials in EMI shielding |
| 5.6.5. |
Meta Materials Inc develop rolling mask lithography |
| 5.6.6. |
Rolling mask lithography: Advantages and disadvantages |
| 5.6.7. |
Transparent EMI shielding with metamaterials |
| 5.6.8. |
Transparent EMI shielding in microwave ovens |
| 5.6.9. |
Niche availability may deter consumers |
| 5.6.10. |
Metamaterials: SWOT analysis |
| 5.6.11. |
Conclusions: Metamaterials for EMI shielding |
| 5.7. |
MXenes |
| 5.7.1. |
MXenes – a novel material promising for conformal EMI shielding |
| 5.7.2. |
Introduction: MXenes for EMI shielding |
| 5.7.3. |
Value propositions of MXenes for EMI shielding |
| 5.7.4. |
MXene composition effects shielding effectiveness |
| 5.7.5. |
MXene processing conditions influence shielding effectiveness |
| 5.7.6. |
Scalable batch production of MXenes |
| 5.7.7. |
Early stage development of MXenes |
| 5.7.8. |
MXenes: SWOT analysis |
| 5.7.9. |
Conclusions: MXenes for EMI shielding |
| 5.8. |
Thermal interface materials with EMI shielding properties |
| 5.8.1. |
Introduction: EMI shielding via thermal interface materials (TIMs) |
| 5.8.2. |
Considerations for using TIMs for EMI shielding |
| 5.8.3. |
TIMs for EMI shielding for ADAS radars |
| 5.8.4. |
Density and thermal conductivity of TIMs for radar |
| 5.8.5. |
Conclusions: Combined EMI/TIMs |
| 6. |
APPLICATION SECTORS FOR EMI SHIELDING |
| 6.1. |
Overview |
| 6.1.1. |
Application sectors for conformal EMI shielding |
| 6.2. |
Application specific trends and considerations |
| 6.2.1. |
System-in-package architecture with integrated EMI shielding for 5G |
| 6.2.2. |
System-in-package enabling technologies for mobile |
| 6.2.3. |
Achieving AR/VR/MR device compactness requires conformal package level EMI shielding |
| 6.2.4. |
EMI shielding for MEMS sensor packages |
| 6.2.5. |
EMI shielding for leadframe packages in automotive electronics (I) |
| 6.2.6. |
EMI shielding for leadframe packages in automotive electronics (II) |
| 6.3. |
EMI shielding deployment examples |
| 6.3.1. |
Laptop deployment example: MacBook Air M2 |
| 6.3.2. |
Laptop deployment example: Microsoft Surface 3 |
| 6.3.3. |
Smartwatch deployment example: Apple Watch Series 1 and Series 8 Ultra |
| 6.3.4. |
Smartwatch deployment example: Samsung Galaxy Watch 4 |
| 6.3.5. |
Smartwatch deployment example: Apple iPhone X |
| 6.3.6. |
Smartphone deployment example: Conformal shielding in Apple iPhone 12 |
| 6.3.7. |
Smartphone deployment example: Samsung Galaxy S23 |
| 6.3.8. |
Tablet deployment example: Apple iPad Air 8 |
| 6.3.9. |
5G infrastructure deployment example: Intel and Ericsson 28 GHz All-silicon 64 Dual Polarized Antenna |
